The practice of decoupling has been performed for thousands of years by using a layer of sand under stone floors.
Ditra for floors.
That movement will cause tile cracks without a layer of motion absorbing material such as ditra.
It provides uncoupling to prevent cracked tile and grout.
Ditra will forever change the way you lay tile.
Ditra is an excellent choice for use in any application where radiant heating is installed in the floor.
Ditra was invented by schluter systems back in 1987 and is used extensively in commercial and residential tile installations.
Schluter ditra underlayment is an uncoupling membrane that allows the tile floor to move in plane relative to the substrate eliminating the major causes for cracked and delaminated tile.
Ditra is an uncoupling membrane designed for ceramic and stone tile installations on floors.
Uncoupling waterproofing vapor management and support to ensure a long lasting installation.
It is made of polyethylene creating a waterproofing layer protecting the substrate.
The stud structure of ditra heat is specifically designed to allow for the easy installation of ditra heat e hk heating cables.
The combination of these four essential functions allows for the successful installation of tile over a wide range of substrates including plywood osb concrete gypsum heated floors etc.
Floors with radiant heat.
Heat causes materials to expand and they shrink again when they cool.
Ditra is the easiest way to waterproof your floor and prevent tile grout from cracking.
Ditra is a polyethylene uncoupling underlayment with a grid ditra is an uncoupling membrane designed for ceramic and stone tile installations on floors.
It provides uncoupling to prevent cracked tile and grout.
Ceramic and stone tiles are durable easy to maintain and hygienic representing the ideal surface coverings.
However today s lightweight construction methods can make the installation of hard surface coverings particularly challenging.
It is made of polyethylene creating a waterproofing layer protecting the substrate.